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ODU AMC High-Density

ODU AMC High-Density
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Innovation in a compact package. From medical technology to consumer electronics to automotive technology: the trend toward miniaturization continues.
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With a diameter of less than 10 mm to 18.5 mm and a contact density of up to 40 contacts, the ODU AMC High-Density series proves that premium quality can also come in small packages. In addition to the High-Density signal connector, the range also includes versions for "Power" (up to 15 A) and "Data Transfer" (USB 3.0 with 5A power) in the most compact space.  
 
  • Smallest Dimension
  • Compact Design
  • High Contact Density
  • System Solution
  • Innovative options for assembly and extrusion for the cable bend relief
  • Quick and easy demating
  • Low space requirements for devices
  • Low force required
Features:
  • 2 – 40 poles
  • Watertight protection class IP 68
  • Break-Away for maximum safety
  • Operating temperature range from -51° C (-60° F) to +125° C (+257° F)
  • Light, compact and easy to use – blind mating is also possible
  • Maximum operating reliability thanks to mechanical keying and visual colour coding
  • Salt spray resistance
  • Connection to flex or printed circuit board solutions on the receptacle side
  • Innovative options for assembly and extrusion for the cable bend relief
  • 4 sizes
  • Lifetime of greater than 5,000 mating cycles
  • Extremely robust and stable housing with non-reflecting surface
  • Contacts for solder and PCB termination
  • Highspeed data technology
  • Versatile and individually configurable: Signal, power and data possible within one connector
  • 360° shielding for excellent, trouble-free data transfer
  • Termination to PC-boards,flex-layers or rigid-flex solutions
To view the ODU AMC High Density brochure, click here. pdficon large