With a diameter of less than 10 mm to 18.5 mm and a contact density of up to 40 contacts, the ODU AMC High-Density series proves that premium quality can also come in small packages. In addition to the High-Density signal connector, the range also includes versions for "Power" (up to 15 A) and "Data Transfer" (USB 3.0 with 5A power) in the most compact space.
Smallest Dimension
Compact Design
High Contact Density
System Solution
Innovative options for assembly and extrusion for the cable bend relief
Quick and easy demating
Low space requirements for devices
Low force required
Features:
2 – 40 poles
Watertight protection class IP 68
Break-Away for maximum safety
Operating temperature range from -51° C (-60° F) to +125° C (+257° F)
Light, compact and easy to use – blind mating is also possible
Maximum operating reliability thanks to mechanical keying and visual colour coding
Salt spray resistance
Connection to flex or printed circuit board solutions on the receptacle side
Innovative options for assembly and extrusion for the cable bend relief
4 sizes
Lifetime of greater than 5,000 mating cycles
Extremely robust and stable housing with non-reflecting surface
Contacts for solder and PCB termination
Highspeed data technology
Versatile and individually configurable: Signal, power and data possible within one connector
360° shielding for excellent, trouble-free data transfer
Termination to PC-boards,flex-layers or rigid-flex solutions
Features: